Publications

32 results for Toyohiro Aoki

IMC bonding for 3D interconnection
- - Katsuyuki Sakuma
  - Kuniaki Sueoka
  - et al.
- 2010
- ECTC 2010
Chip-to-Package Interaction for a 90 nm Cu / PECVD Low-k technology
- - W. Landers
  - D. Edelstein
  - et al.
- 2004
- IITC 2004