Characterization of micro bump formed by Injection Molded Solder (IMS) technology
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- Kazushige Toriyama
- et al.
- 2014
- ICEP 2014
Conference paper
Publications
35 results for Toyohiro Aoki
Low power CMOS-driven 1060 nm multimode optical link
- Jean Benoit Héroux
- Tomofumi Kise
- et al.
- 2014
- OFC 2014
Conference paperScaling challenges of semiconductor packaging in the era of big data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- IMAPS 2013
Conference paperIMC bonding for 3D interconnection
- Katsuyuki Sakuma
- Kuniaki Sueoka
- et al.
- 2010
- ECTC 2010
Conference paperChip-to-Package Interaction for a 90 nm Cu / PECVD Low-k technology
- W. Landers
- D. Edelstein
- et al.
- 2004
- IITC 2004
Conference paper