Publications

35 results for Toyohiro Aoki

Characterization of micro bump formed by Injection Molded Solder (IMS) technology
- - Toyohiro Aoki
  - Kazushige Toriyama
  - et al.
- 2014
- ICEP 2014
Low power CMOS-driven 1060 nm multimode optical link
- - Jean Benoit Héroux
  - Tomofumi Kise
  - et al.
- 2014
- OFC 2014
Scaling challenges of semiconductor packaging in the era of big data
- - Yasumitsu Orii
  - Akihiro Horibe
  - et al.
- 2013
- IMAPS 2013
IMC bonding for 3D interconnection
- - Katsuyuki Sakuma
  - Kuniaki Sueoka
  - et al.
- 2010
- ECTC 2010
Chip-to-Package Interaction for a 90 nm Cu / PECVD Low-k technology
- - W. Landers
  - D. Edelstein
  - et al.
- 2004
- IITC 2004