Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2021
- ICEP 2021
Publications
35 results for Toyohiro Aoki
Fine pitch bumping and flip chip joining with Sn-BI based solders by injection molded solder technology
- Toyohiro Aoki
- Katsuhiro Yoshida
- et al.
- 2021
- ICEP 2021
Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability
- Risa Miyazawa
- Eiji Nakamura
- et al.
- 2021
- Advancing Microelectronics
Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology
- Eiji Nakamura
- Toyohiro Aoki
- et al.
- 2021
- Advancing Microelectronics
Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
- Toyohiro Aoki
- Eiji Nakamura
- et al.
- 2020
- ECTC 2020
Implementation challenges for scalable neuromorphic computing
- Shintaro Yamamichi
- Akihiro Horibe
- et al.
- 2017
- VLSI Circuits 2017
Implementation challenges for scalable neuromorphic computing
- Shintaro Yamamichi
- Akihiro Horibe
- et al.
- 2017
- VLSI Technology 2017
Flip chip joining with low temperature solders and thermal gradient bonding
- Toyohiro Aoki
- Eiji Nakamura
- et al.
- 2017
- ICEP 2017
Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
- Toyohiro Aoki
- Takashi Hisada
- et al.
- 2016
- ECTC 2016
Solder Injected through Via for Multi Stacked Wafers
- Akihiro Horibe
- Kuniaki Sueoka
- et al.
- 2016
- ECTC 2016