Publications

79 results for John Knickerbocker

IMC bonding for 3D interconnection
- - Katsuyuki Sakuma
  - Kuniaki Sueoka
  - et al.
- 2010
- ECTC 2010
24-channel optical transceiver module for waveguide-on-card interconnects
- - Jeffrey A. Kash
  - Clint L. Schow
  - et al.
- 2010
- OFC/NFOEC 2010
24-Channel optical transceiver module for waveguide-on-card interconnects
- - Jeffrey A. Kash
  - Clint L. Schow
  - et al.
- 2010
- OFC 2010
Die-to-wafer 3D integration technology for high yield and throughput
- - Katsuyuki Sakuma
  - Paul S. Andry
  - et al.
- 2008
- MRS Fall Meeting 2008
Reliable through silicon vias for 3D silicon applications
- - M.J. Shapiro
  - M. Interrante
  - et al.
- 2009
- IITC 2009
Terabus: Chip-to-chip board-level optical data buses
- - J.A. Kash
  - F.E. Doany
  - et al.
- 2008
- LEOS 2008
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- - D.Y. Shih
  - B. Dang
  - et al.
- 2008
- ICEPT-HDP 2008
3D silicon integration
- - J. Knickerbocker
  - P. Andry
  - et al.
- 2008
- ECTC 2008
300-Gb/s 24-channel bidirectional Si carrier transceiver optochip for board-level interconnects
- - Fuad E. Doany
  - Clint L. Schow
  - et al.
- 2008
- ECTC 2008
50μm pitch Pb-free micro-bumps by C4NP technology
- - Bing Dang
  - Da-Yuan Shih
  - et al.
- 2008
- ECTC 2008