Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- IEDM 2005
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14 results for Richard Conti
Assembly technology for three dimensional integrated circuits
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- VMIC 2005
Hardmask technology for sub-100 nm lithographic imaging
- Katherina Babich
- Arpan P. Mahorowala
- et al.
- 2003
- Microlithography 2003
Tunable anti-reflective coatings with built-in hard mask properties facilitating thin resist processing
- Arpan P. Mahorowala
- Katherina Babich
- et al.
- 2001
- Proceedings of SPIE - The International Society for Optical Engineering