Fluxless TCB with Atmospheric Pressure Plasma Surface Treatment Enabling Ultra-Fine Pitch Solder Micro-Bumps for 3D Integration
- Mohammed Alhendi
- Luke Darling
- et al.
- 2026
- ECTC 2026
Publications
2 results for Neng Liu
Co-packaged optics module with single mode polymer waveguide
- Akihiro Horibe
- Yoichi Taira
- et al.
- 2025
- IEDM 2025