Annealing and impurity effects in co thin films for MOL Contact and BEOL metallization
- James Kelly
- Vimal Kamineni
- et al.
- 2018
- JES
Paper
Publications
9 results for X. Lin
Experimental study of PVD Cu/CVD Co bilayer dissolution for BEOL Cu interconnect applications
- X. Sun
- B. Peethala
- et al.
- 2017
- ECS Meeting 2017
Conference paperComparison of key fine-line BEOL metallization schemes for beyond 7 nm node
- Takeshi Nogami
- X. Zhang
- et al.
- 2017
- VLSI Technology 2017
Conference paperMethods to lower the resistivity of ruthenium interconnects at 7 nm node and beyond
- Xunyuan Zhang
- Huai Huang
- et al.
- 2017
- IITC 2017
Conference paperPerformance of ultrathin alternative diffusion barrier metals for next - Generation BEOL technologies, and their effects on reliability
- Takeshi Nogami
- M. Chae
- et al.
- 2014
- IITC/AMC 2014
Conference paperCVD-Co/Cu(Mn) integration and reliability for 10 nm node
- Takeshi Nogami
- M. He
- et al.
- 2013
- IITC 2013
Conference paperElectrodeposited Cu film morphology on thin PVD Cu seed layers
- James Kelly
- X. Lin
- et al.
- 2013
- JES
PaperMechanism of co liner as enhancement layer for Cu interconnect gap-fill
- M. He
- X. Zhang
- et al.
- 2013
- JES
PaperElectrodeposited Cu film morphology on thin PVD Cu seed layers
- James J. Kelly
- X. Lin
- et al.
- 2013
- ECS Transactions
Conference paper