Quantifying the stress relaxation modulus of polymer thin films via thermal wrinkling
- Edwin P. Chan
- Santanu Kundu
- et al.
- 2010
- ACS AMI
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48 results for Qinghuang Lin
Silsesquioxane-based photo-patternable porous low-k
- Dielectric Materials
- Jitendra S. Rathore
- et al.
- 2010
- MRS Spring Meeting 2010
Patternable low-κ material for "greener" semiconductor manufacturing
- Qinghuang Lin
- Shyng-Tsong Chen
- et al.
- 2010
- ICSICT 2010
Multi-level integration of patternable low-κ material into advanced Cu BEOL
- Qinghuang Lin
- Shyng-Tsong Chen
- et al.
- 2010
- Proceedings of SPIE - The International Society for Optical Engineering 2010
Integration of photo-patternable low-κ material into advanced Cu back-end-of-the-line
- Qinghuang Lin
- Alshakim Nelson
- et al.
- 2010
- Japanese Journal of Applied Physics
Thermally induced wrinkling in thin-film stacks on patterned substrates
- K. Srinivasan
- S. Goyal
- et al.
- 2009
- IBM J. Res. Dev
Low dielectric constant nanocomposite thin films based on silica nanoparticle and organic thermosets
- Qinghuang Lin
- Stephen A. Cohen
- et al.
- 2007
- Journal of Polymer Science, Part B: Polymer Physics
BEOL integration of highly damage -resistant porous ultra low-k material using direct CMP and via-first process
- T. Iijima
- Q. Lin
- et al.
- 2006
- IITC 2006
Cross section and critical dimension metrology in dense high aspect ratio patterns with CD-SAXS
- Ronald L. Jones
- Eric K. Lin
- et al.
- 2005
- International Conference on Characterization and Metrology for ULSI Technology 2005
Application of nanoindentation to characterize fracture in ILD films used in the BEOL
- Eva E. Simonyi
- E. Liniger
- et al.
- 2005
- MRS Spring Meeting 2005