Publications

3 results for H. Dalai

A Highly Reliable Low Temperature Al-Cu Line/Via Metallization for Sub-Half Micrometer CMOS
- - R.V. Joshi
  - H. Dalai
  - et al.
- 1995
- IEEE Electron Device Letters
Paper
A DUAL DAMASCENE HARD METAL CAPPED CU AND AL-ALLOY FOR INTERCONNECT WIRING OF ULSI CIRCUITS
- - H. Dalai
  - R.V. Joshi
  - et al.
- 1993
- IEDM 1993
Conference paper
A novel application of polyimide-W-AI/CU for VLSI interconnect
- - R.V. Joshi
  - L. Hsu
  - et al.
- 1991
- VMIC 1991
Conference paper