Publications

2 results for M. Anschel

Adhesion test standardization for multichip module packages
- - D.Y. Shih
  - J. Kim
  - et al.
- 1995
- ECTC 1995
Conference paper
Use of high temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface modified by an ac nitrogen glow discharge
- - J.B. Ma
  - J. Dragon
  - et al.
- 1995
- Journal of Adhesion Science and Technology
Paper