Publications

2 results for C. Nichols

Thin, high atomic weight refractory film deposition for diffusion barrier, adhesion layer, and seed layer applications
- - S.M. Rossnagel
  - C. Nichols
  - et al.
- 1996
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Ionized physical vapor deposition of Cu for high aspect ratio damascene trench fill applications
- - C. Nichols
  - S.M. Rossnagel
  - et al.
- 1996
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures