Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz
- Renato Rimolo-Donadio
- Xiaoxiong Gu
- et al.
- 2009
- IEEE T-MTT
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53 results for Mark B. Ritter
Impedance design for multi-layered vias
- Xiaoxiong Gu
- Albert E. Ruehli
- et al.
- 2008
- EPEPS 2008
Application of foldy-lax multiple scattering method to via analysis in multi-layered printed circuit board
- Xiaoxiong Gu
- Mark B. Ritter
- 2008
- DesignCon 2008
Multi-level signaling in high-density, high-speed electrical links
- Dong G. Kam
- Troy J. Beukema
- et al.
- 2008
- DesignCon 2008
The viability of 25 Gb/s on-board signalling
- Mark B. Ritter
- Petar Pepeljugoski
- et al.
- 2008
- ECTC 2008
Analysis and optimization of the recessed probe launch for high frequency measurements of PCB interconnects
- Renato Rimolo-Donadio
- Christian Schuster
- et al.
- 2008
- DATE 2008
Comparison of bandwidth limits for on-card electrical and optical interconnects for 100 Gb/s and beyond
- Petar Pepeljugoski
- Mark Ritter
- et al.
- 2008
- SPIE IOPTO 2008
Developing a "physical" model for vias - Part II: Coupled and ground return vias
- Giuseppe Selli
- Christian Schuster
- et al.
- 2007
- DesignCon 2007
Signal propagation over perforated reference planes
- Lei Shan
- Mark Ritter
- et al.
- 2007
- IEEE-SPI 2007
Progress in representation and validation of physics-based via models
- Christian Schuster
- Giuseppe Selli
- et al.
- 2007
- IEEE-SPI 2007