Publications

119 results for Stephan A. Cohen

Contamination mitigation of hydrogen silsesquioxane resist processed with Na⁺-containing developer for nanoscale CMOS device patterning
- - Markus Brink
  - Isaac Lauer
  - et al.
- 2014
- Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics
UV cure impact on robust low-k with sub-nm pores and high carbon content for high performance Cu/low-k BEOL modules
- - N. Inoue
  - F. Ito
  - et al.
- 2013
- IITC 2013
Post Porosity Plasma Protection applied to a wide range of ultra low-k materials
- - Theo Frot
  - Willi Volksen
  - et al.
- 2012
- IITC 2012
Tailoring dielectric materials for robust BEOL reliability
- - G. Bonilla
  - T.M. Shaw
  - et al.
- 2012
- IRPS 2012
Experimental confirmation of electron fluence driven, Cu catalyzed interface breakdown model for low-k TDDB
- - Fen Chen
  - Jeffrey Gambino
  - et al.
- 2012
- IRPS 2012
Effective Cu surface pre-treatment for high-reliable 22 nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k = 2.2)
- - F. Ito
  - H. Shobha
  - et al.
- 2012
- Microelectronic Engineering
Synergistic combinations of dielectrics and metallization process technology to achieve 22 nm interconnect performance targets
- - G.A. Antonelli
  - G. Jiang
  - et al.
- 2012
- Microelectronic Engineering
Processing and moisture effects on TDDB for Cu/ULK BEOL structures
- - E. Liniger
  - T.M. Shaw
  - et al.
- 2012
- Microelectronic Engineering
Effects of chemical mechanical polishing on a porous SiCOH dielectric
- - S. Gates
  - S. Papa Rao
  - et al.
- 2012
- Microelectronic Engineering
Integration of a manufacturing grade, k = 2.0 spin-on material in a single damascene structure
- - Willi Volksen
  - Sampath Purushothaman
  - et al.
- 2012
- ECS J. Solid State Sci. Technol.