Characterization of thin dielectric films as copper diffusion barriers using triangular voltage sweep
- S. Cohen
- J.C. Liu
- et al.
- 1999
- MRS Spring Meeting 1999
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119 results for Stephan A. Cohen
Low dielectric constant SiCOH films as potential candidates for interconnect dielectrics
- A. Grill
- L. Perraud
- et al.
- 1999
- MRS Spring Meeting 1999
Characterization of thin dielectric films as copper diffusion barriers using triangular voltage sweep
- S. Cohen
- J.C. Liu
- et al.
- 1999
- MRS Spring Meeting 1999
Properties development during curing of low dielectric-constant spin-on glasses
- R.F. Cook
- E. Liniger
- et al.
- 1998
- MRS Spring Meeting 1998
Effects of wafer cleaning reduction on metals removal and ultrathin gate oxide quality
- C. D'Emic
- S. Cohen
- et al.
- 1997
- MRS Spring Meeting 1997
Use of SiBN and SiBON films prepared by plasma enhanced chemical vapor deposition from borazine as interconnection dielectrics
- W.F. Kone
- S. Cohen
- et al.
- 1997
- JES
Diamondlike carbon materials as low-k dielectrics for multilevel interconnects in ULSI
- A. Grill
- V.V. Patel
- et al.
- 1996
- MRS Fall Meeting 1996
Adhesion of poly(arylene ether benzimidazole) to copper and polyimides
- K.-W. Lee
- A. Viehbeck
- et al.
- 1996
- Journal of Adhesion Science and Technology
Lithography and fabrication processes for sub-100 nm scale complementary metal-oxide semiconductor
- S.J. Wind
- Y. Taur
- et al.
- 1995
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Characterization of defects produced in TEOS thin films due to chemical-mechanical polishing (CMP)
- F.B. Kaufman
- S. Cohen
- et al.
- 1995
- MRS Spring Meeting 1995