Synergistic combinations of dielectrics and metallization process technology to achieve 22 nm interconnect performance targets
- G.A. Antonelli
- G. Jiang
- et al.
- 2012
- Microelectronic Engineering
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119 results for Stephan A. Cohen
Effects of chemical mechanical polishing on a porous SiCOH dielectric
- S. Gates
- S. Papa Rao
- et al.
- 2012
- Microelectronic Engineering
Integration of a manufacturing grade, k = 2.0 spin-on material in a single damascene structure
- Willi Volksen
- Sampath Purushothaman
- et al.
- 2012
- ECS J. Solid State Sci. Technol.
A Manufacturing grade, porous oxycarbosilane spin-on dielectric candidate with K 2.0
- Willi Volksen
- Teddie P. Magbitang
- et al.
- 2011
- JES
Integration of photo-patternable low-κ material into advanced Cu back-end-of-the-line
- Qinghuang Lin
- Alshakim Nelson
- et al.
- 2010
- Japanese Journal of Applied Physics
Property modifications of nanoporous pSiCOH dielectrics to enhance resistance to plasma-induced damage
- E. Todd Ryan
- Stephen M. Gates
- et al.
- 2008
- Journal of Applied Physics
Mechanical enhancement of low- k organosilicates by laser spike annealing
- Willi Volksen
- Geraud Dubois
- et al.
- 2008
- JES
Low dielectric constant nanocomposite thin films based on silica nanoparticle and organic thermosets
- Qinghuang Lin
- Stephen A. Cohen
- et al.
- 2007
- Journal of Polymer Science, Part B: Polymer Physics
The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics
- J.R. Lloyd
- C.E. Murray
- et al.
- 2006
- Microelectronics Reliability
Structure-property relationships of hydrido organo siloxane polymer (HOSP)
- Ann R. Fornof
- Christy Tyberg
- et al.
- 2002
- Polymer Bulletin