Reduced Cu interface diffusion by CoWP surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Microelectronic Engineering
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129 results for Eric G. Liniger
Relationship between interfacial adhesion and electromigration in Cu metallization
- J.R. Lloyd
- M.W. Lane
- et al.
- 2002
- IIRW 2002
Bimodal electromigration mechanisms in dual-damascene Cu line/via on W
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- IITC 2002
Modified edge lift-off test: Experimental modifications for multifilm systems
- J.C. Hay
- E. Liniger
- et al.
- 2000
- MRS Online Proceedings Library
A high performance 0.13 μm copper BEOL technology with low-k dielectric
- R.D. Goldblatt
- B.N. Agarwala
- et al.
- 2000
- IITC 2000
Electromigration challenges for nanoscale Cu wiring
- C.-K. Hu
- L. Gignac
- et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
Extreme-low k porous pSiCOH dielectrics prepared by PECVD
- H. You
- Petra Mennell
- et al.
- 2018
- JVSTB
Low hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- Son Van Nguyen
- Shobha Hosadugra
- et al.
- 2017
- ECS J. Solid State Sci. Technol.
Advanced single precursor based pSiCOH k = 2.4 for ULSI interconnects
- Deepika Priyadarshini
- Son Van Nguyen
- et al.
- 2017
- JVSTB
Impedance spectroscopy studies of moisture uptake in low-k dielectrics and its relation to reliability
- A. Raja
- Robert B. Laibowitz
- et al.
- 2015
- Microelectronic Engineering