Low-k BEOL mechanical modeling
- Xiao Hu Liu
- Michael W. Lane
- et al.
- 2004
- ADMETA 2004
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129 results for Eric G. Liniger
Successful dual damascene integration of extreme low k materials (k < 2.0) using a novel gap fill based integration scheme
- S.V. Nitta
- S. Purushothaman
- et al.
- 2004
- IEDM 2004
Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology
- D. Edelstein
- C.R. Davis
- et al.
- 2004
- IITC 2004
Optimization of SiCOH dielectrics for integration in a 90 nm CMOS technology
- A. Grill
- D. Edelstein
- et al.
- 2004
- IITC 2004
90 nm SiCOH technology in 300 mm manufacturing
- L. Clevenger
- M. Yoon
- et al.
- 2004
- ADMETA 2004
Moisture-driven crack growth in blanket low dielectric constant and ultralow dielectric constant films
- E. Liniger
- E. Simonyi
- 2004
- Journal of Applied Physics
Time dependent dielectric breakdown in a low-k interlevel dielectric
- J.R. Lloyd
- E. Liniger
- et al.
- 2004
- Microelectronics Reliability
Reliability challenges with ultra-low k interlevel dielectrics
- J.R. Lloyd
- M. Lane
- et al.
- 2004
- Microelectronics Reliability
Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- C.-K. Hu
- D. Canaperi
- et al.
- 2004
- IRPS 2004
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004