Integration of photo-patternable low-κ material into advanced Cu back-end-of-the-line
- Qinghuang Lin
- Alshakim Nelson
- et al.
- 2010
- Japanese Journal of Applied Physics
Paper
Publications
129 results for Eric G. Liniger
Electromigration challenges for nanoscale Cu wiring
- C.-K. Hu
- L. Gignac
- et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
Workshop paperOn the contribution of line-edge roughness to intralevel TDDB lifetime in low-k dielectrics
- J.R. Lloyd
- X.-H. Liu
- et al.
- 2009
- IRPS 2009
Conference paperMaterial and process for advanced Cu/ULK integration
- Chih-Chao Yang
- Daniel C. Edelstein
- et al.
- 2008
- ADMETA 2008
Conference paperIntegration compatible porous SiCOH dielectrics from 45 to 22 nm
- S. Gates
- A. Grill
- et al.
- 2008
- ADMETA 2008
Conference paperAdvanced bilayer low-k dielectric cap for reliable high performance Cu-low k interconnects
- Griselda Bonilla
- Lawrence A. Clevenger
- et al.
- 2008
- ADMETA 2008
Conference paperIntegration and reliability of CVD Ru Cap for Cu/Low-k development
- C.-C. Yang
- D. Edelstein
- et al.
- 2009
- IITC 2009
Conference paperPore orientation and silylation effects on mesoporous silica film properties
- A.P. Singh
- D.D. Gandhi
- et al.
- 2009
- Applied Physics Letters
PaperElectromigration reliability in nanoscale Cu interconnects
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- MRS Fall Meeting 2007
Conference paperA multilevel copper/low-k/airgap BEOL technology
- S.V. Nitta
- S. Ponoth
- et al.
- 2007
- ADMETA 2007
Conference paper