In situ study of void growth kinetics in electroplated Cu lines
- E. Liniger
- L. Gignac
- et al.
- 2002
- Journal of Applied Physics
Paper
Publications
129 results for Eric G. Liniger
Electromigration in on-chip single/dual damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- JES
PaperBimodal electromigration mechanisms in dual-damascene Cu line/via on W
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- IITC 2002
Conference paperEvaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications
- Jack C. Hay
- Eric G. Liniger
- et al.
- 2001
- Journal of Materials Research
PaperModified edge lift-off test: Experimental modifications for multifilm systems
- J.C. Hay
- E. Liniger
- et al.
- 2000
- MRS Online Proceedings Library
Conference paperA high performance 0.13 μm copper BEOL technology with low-k dielectric
- R.D. Goldblatt
- B.N. Agarwala
- et al.
- 2000
- IITC 2000
Conference paperDivergence effects in monochromatic x-ray microdiffraction using tapered capillary optics
- I.C. Noyan
- P.-C. Wang
- et al.
- 2000
- Review of Scientific Instruments
PaperThe effect of stress on the dielectric properties of barium strontium titanate thin films
- T.M. Shaw
- Z. Suo
- et al.
- 1999
- Applied Physics Letters
PaperPorous organosilicates for on-chip dielectric applications
- R.D. Miller
- R. Beyers
- et al.
- 1999
- MRS Spring Meeting 1999
PaperStress-Corrosion Cracking of Low-Dielectric-Constant Spin-On-Glass Thin Films
- Robert F. Cook
- Eric G. Liniger
- 1999
- JES
Paper