Publications

3 results for Antoinette M. Maniatty

Modeling Effect of Grain Orientation on Degradation in Tin-Based Solder - Part II: Electromigration Experiments
- - Jiamin Ni
  - Matt Ring
  - et al.
- 2019
- IEEE Transactions on CPMT
Paper
Modeling effect of grain orientation on degradation in tin-based solder: I. current-driven diffusion
- - Yuanxiang Zhang
  - Jiamin Ni
  - et al.
- 2019
- IEEE Transactions on CPMT
Paper
Thermal and electromigration-induced strains in copper conductor lines: X-ray microbeam measurements and analysis
- - G. Wang
  - H. Zhang
  - et al.
- 2006
- MRS Spring Meeting 2006
Conference paper