Retardation of arsenic diffusion in silicon-germanium by co-implantationOmer DokumaciPaul Ronsheimet al.2004ECS Meeting 2004
Sub-30 NM abrupt junction formation in strained silicon/silicon-germanium CMOS deviceK.-L. LeeF. Cardoneet al.2004ECS Meeting 2004
A Simplified Hybrid Orientation Technology (SHOT) for high performance CMOSB. DorisY. Zhanget al.2004VLSI Technology 2004
20 nm N + abrupt junction formation in Strained Si/Si 1-xGe x MOS deviceK.L. LeeF. Cardoneet al.2003IEDM 2003
Fabrication and Mobility Characteristics of Ultra-thin Strained Si Directly on Insulator (SSDOI) MOSFETsK. RimK.K. Chanet al.2003IEDM 2003
Metal-gate FinFET and fully-depleted SOI devices using total gate silicidationJakub KedzierskiEdward Nowaket al.2002IEDM 2002
Sub-30 nm P+ abrupt junction formation in strained Si/Si1-xGex MOS deviceK.L. LeeJ.O. Chuet al.2002IEDM 2002
Modeling of the diffusion of implanted boron in strained Si/Si1-xGexHuilong ZhuKam-Leung Leeet al.2002SISPAD 2002