Interfacial reaction studies on lead (Pb)-free solder alloys
- Sung K. Kang
- D.Y. Shih
- et al.
- 2002
- IEEE Transactions on Electronics Packaging Manufacturing
Paper
Publications
4 results for Myung-Jin Yim
Studies of the mechanical and electrical properties of lead-free solder joints
- S.K. Kang
- W.K. Choi
- et al.
- 2002
- Journal of Electronic Materials
PaperInterfacial reaction studies on lead (Pb)-free solder alloys
- S.K. Kang
- D.Y. Shih
- et al.
- 2001
- ECTC 2001
Conference paperEffect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates
- Myung-Jin Yim
- Kyung-Wook Paik
- 2001
- IEEE Transactions on Components and Packaging Technologies
Paper