Publications

2 results for Tae K. Hwang

Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
- - Sung K. Kang
  - Paul Lauro
  - et al.
- 2004
- ECTC 2004
Conference paper
The microstructure, thermal fatigue, and failure analysis of near-ternary eutectic Sn-Ag-Cu solder joints
- - Sung K. Kang
  - Paul Lauro
  - et al.
- 2004
- Materials Transactions
Paper