Publications

3 results for Guy P. Brouillette

Low-cost wafer bumping
- - Peter A. Gruber
  - Luc Bélanger
  - et al.
- 2005
- IBM J. Res. Dev
Review
Injection molded solder technology for Pb-free wafer bumping
- - P. Gruber
  - D.Y. Shih
  - et al.
- 2004
- ECTC 2004
Conference paper
Pb-free solder alloys for flip chip applications
- - S.K. Kang
  - J. Horkans
  - et al.
- 1999
- ECTC 1999
Conference paper