Effect of intermetallics spalling on the mechanical behavior of electroless Ni(P)/Pb-free solder interconnection
- Yoon-Chul Sohn
- Jin Yu
- et al.
- 2005
- ECTC 2005
Conference paper
Publications
4 results for Taek-Yeong Lee
Study of spalling behavior of Intel-metallic compounds during the reaction between electroless Ni-P metallization and lead-free solders
- Yoon-Chul Sohn
- Jin Yu
- et al.
- 2004
- ECTC 2004
Conference paperSpalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization
- Y.C. Sohn
- Jin Yu
- et al.
- 2004
- Journal of Materials Research
PaperSpalling behaviors of intel-metallic compounds during the etting reaction of Sn(3.5Ag) on electroless Ni-P metallization
- Yoon-Chul Sohn
- Jin Yu
- et al.
- 2004
- AGEC 2004
Conference paper