Publications

3 results for Domenico A. Dipaola

LCDU improvement of EUV-patterned vias with DSA
- - Jing Guo
  - Dustin W. Janes
  - et al.
- 2019
- MEMS/NEMS/MOEMS 2019
Optimizing Models Based OPC fragmentation using genetic algorithms
- - Domenico A. Dipaola
  - Ian Mobert
- 2008
- SPIE Photomask Technology + EUV Lithography 2008
A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid cu-adhesive bonding
- - F. Liu
  - R.R. Yu
  - et al.
- 2008
- IEDM 2008