Publications

2 results for J.O. Suh

Electromigration study in flip chip solder joints
- - Jae-Woong Nah
  - Kai Chen
  - et al.
- 2007
- ECTC 2007
Conference paper
Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect
- - Jae-Woong Nah
  - J.O. Suh
  - et al.
- 2006
- Journal of Applied Physics
Paper