Electromigration study in flip chip solder joints
- Jae-Woong Nah
- Kai Chen
- et al.
- 2007
- ECTC 2007
Publications
2 results for Kai Chen
Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization
- Jae-Woong Nah
- Kai Chen
- et al.
- 2007
- Journal of Materials Research