Publications

48 results for Xiao Hu Liu

Chip-package-interaction modeling of ultra low-k/copper back end of line
- - X.-H. Liu
  - T.M. Shaw
  - et al.
- 2007
- IITC 2007
Delamination in patterned films
- - X.-H. Liu
  - M.W. Lane
  - et al.
- 2007
- Int. J. Solids Struct.
Integration of local stress techniques with strained-Si directly on insulator (SSDOI) substrates
- - Haizhou Yin
  - Z. Ren
  - et al.
- 2006
- VLSI Technology 2006
High performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithography
- - S. Narasimha
  - K. Onishi
  - et al.
- 2006
- IEDM 2006
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- - S. Sankaran
  - S. Arai
  - et al.
- 2006
- IEDM 2006
65nm Cu integration and interconnect reliability in low stress K=2.75 SiCOH
- - V. McGahay
  - G. Bonilla
  - et al.
- 2006
- IITC 2006
Theory for electromigration failure in Cu conductors
- - J.R. Lloyd
  - C.E. Murray
  - et al.
- 2005
- International Workshop on Stress-Induced Phenomena in Metallization 2005
Analysis and modeling of curvature in copper-based mems structures fabricated using CMOS interconnect technology
- - Marie-Ange Eyoum
  - Nils Hoivik
  - et al.
- 2005
- TRANSDUCERS 2005
Modelling of dislocations intersecting a free surface
- - X.-H. Liu
  - K.W. Schwarz
- 2005
- Modelling and Simulation in Materials Science and Engineering
Low-k BEOL mechanical modeling
- - Xiao Hu Liu
  - Michael W. Lane
  - et al.
- 2004
- ADMETA 2004