Publications

2 results for D. Gehre

The evolution of barrier properties during reliability testing of Cu interconnects
- - M.A. Meyer
  - O. Aubel
  - et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
Extensive investigations of temperature influence on barrier integrity during reliability testing
- - O. Aubel
  - M.A. Meyer
  - et al.
- 2008
- Microelectronic Engineering