Extended abstract :C4NP - solder bumps for flip chip and microbumps for 3D
- Klaus Ruhmer
- David Hawken
- et al.
- 2008
- GBC 2008
Conference paper
Publications
6 results for Klaus Ruhmer
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- D.Y. Shih
- B. Dang
- et al.
- 2008
- ICEPT-HDP 2008
Conference paper50μm pitch Pb-free micro-bumps by C4NP technology
- Bing Dang
- Da-Yuan Shih
- et al.
- 2008
- ECTC 2008
Conference paperLead free micro bumping - Cost & yield challenges
- Klaus Ruhmer
- Emmett Hughlett
- et al.
- 2007
- EPTC 2007
Conference paperC4NP - IBM manufacturing & reliability data for lead free flip chip solder bumping
- Klaus Ruhmer
- Eric Laine
- et al.
- 2006
- IMPACT 2006
Conference paperC4NP - First manufacturing & reliability data for high-end FlipChip solder bumping based on IBM's C4NP process
- Klaus Ruhmer
- Eric Laine
- et al.
- 2006
- GBC 2006
Conference paper