A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid cu-adhesive bonding
- F. Liu
- R.R. Yu
- et al.
- 2008
- IEDM 2008
Conference paper
Publications
4 results for X. Wang
Low phase noise 5 GHz VCOs in 0.13 μm SOI and bulk CMOS
- David I. Sanderson
- Jonghae Kim
- et al.
- 2006
- ICSICT 2006
Conference paperEnabling RFCMOS solutions for emerging advanced applications
- John J. Pekarik
- Douglas D. Coolbaugh
- et al.
- 2005
- GAAS 2005
Conference paperRFCMOS technology from 0.25μm to 65nm: The state of the art
- J.J. Pekarik
- D.R. Greenberg
- et al.
- 2004
- CICC 2004
Conference paper