Publications

10 results for Franco Zappa

A packaging solution for optically testing wire-bonded chips
- - Alberto Tosi
  - Franco Stellari
  - et al.
- 2008
- IEEE Transactions on Advanced Packaging
Hot-carrier photoemission in scaled CMOS technologies: A challenge for emission based testing and diagnostics
- - Alberto Tosi
  - Franco Stellari
  - et al.
- 2006
- IRPS 2006
Innovative packaging technique for backside optical testing of wire-bonded chips
- - A. Tosi
  - F. Stellari
  - et al.
- 2005
- ESREF 2005
Current crowding in faulty MOSFET: Optical and electrical investigation
- - A. Tosi
  - F. Stellari
  - et al.
- 2004
- Microelectronics Reliability
Hot-carrier luminescence: Comparison of different CMOS technologies
- - Alberto Tosi
  - Franco Stellari
  - et al.
- 2003
- ESSDERC 2003
Backside flip-chip testing by means of high-bandwidth luminescence detection
- - A. Tosi
  - F. Stellari
  - et al.
- 2003
- Microelectronics Reliability
CMOS circuit analysis with luminescence measurements and simulations
- - F. Stellari
  - A. Tosi
  - et al.
- 2002
- ESSDERC 2002
High-speed CMOS circuit testing by 50 ps time-resolved luminescence measurements
- - Franco Stellari
  - Franco Zappa
  - et al.
- 2001
- IEEE Transactions on Electron Devices
Testing CMOS circuits at 50ps resolution with single-photon avalanche detectors
- - S. Cova
  - C. Porta
  - et al.
- 2000
- ESSDERC 2000
A VLSI-compatible high-speed silicon photodetector for optical data link applications
- - Massimo Ghioni
  - Franco Zappa
  - et al.
- 1996
- IEEE Transactions on Electron Devices