Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology
- D. Edelstein
- C.R. Davis
- et al.
- 2004
- IITC 2004
Publications
8 results for X.-H. Liu
Optimization of SiCOH dielectrics for integration in a 90 nm CMOS technology
- A. Grill
- D. Edelstein
- et al.
- 2004
- IITC 2004
Channel cracking in low-k films on patterned multi-layers
- X.-H. Liu
- T.M. Shaw
- et al.
- 2004
- IITC 2004
Reliability challenges with ultra-low k interlevel dielectrics
- J.R. Lloyd
- M. Lane
- et al.
- 2004
- Microelectronics Reliability
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
Environmental effects on cracking and delamination of dielectric films
- Michael W. Lane
- Xia Hu Liu
- et al.
- 2004
- IEEE T-DMR
Modeling of dislocations in an epitaxial island structure
- X.-H. Liu
- F.M. Ross
- et al.
- 2001
- MRS Proceedings 2001
Dislocated epitaxial islands
- X.-H. Liu
- F.M. Ross
- et al.
- 2000
- Physical Review Letters