Publications

2 results for J.G. Ryan

Opportunities and challenges in ultra low k dielectrics for interconnect applications
- - S. Purushothaman
  - S.V. Nitta
  - et al.
- 2001
- Technical Digest-International Electron Devices Meeting
A high performance 0.13 μm copper BEOL technology with low-k dielectric
- - R.D. Goldblatt
  - B.N. Agarwala
  - et al.
- 2000
- IITC 2000