Critical ultra low-k TDDB reliability issues for advanced CMOS technologies
- F. Chen
- M. Shinosky
- et al.
- 2009
- IRPS 2009
Conference paper
Publications
3 results for P. Pokrinchak
Improved electromigration lifetime for copper interconnects using tantalum implant
- Jeff Gambino
- Timothy D. Sullivan
- et al.
- 2007
- MRS Spring Meeting 2007
Conference paperEffect of CoWP cap thickness on via yield and reliability for Cu interconnects with CoWP-only cap process
- J.P. Gambino
- J. Wynne
- et al.
- 2005
- IITC 2005
Conference paper