Critical ultra low-k TDDB reliability issues for advanced CMOS technologies
- F. Chen
- M. Shinosky
- et al.
- 2009
- IRPS 2009
Publications
6 results for S. Mongeon
Reliability of Cu interconnects with Ta implant
- J.P. Gambino
- T.D. Sullivan
- et al.
- 2007
- IITC 2007
Improved electromigration lifetime for copper interconnects using tantalum implant
- Jeff Gambino
- Timothy D. Sullivan
- et al.
- 2007
- MRS Spring Meeting 2007
Stress migration lifetime for Cu interconnects with CoWP-only cap
- Jeffrey P. Gambino
- Christy L. Johnson
- et al.
- 2006
- IEEE T-DMR
Effect of CoWP cap thickness on via yield and reliability for Cu interconnects with CoWP-only cap process
- J.P. Gambino
- J. Wynne
- et al.
- 2005
- IITC 2005
Thermal oxidation of Cu interconnects capped with CoWP
- J.P. Gambino
- S. Smith
- et al.
- 2005
- MRS Spring Meeting 2005