Publications

2 results for C. Taft

CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- - E. Huang
  - M. Oh
  - et al.
- 2009
- ADMETA 2009
Nanoporous materials integration into advanced microprocessors
- - E. Todd Ryan
  - Cathy Labelle
  - et al.
- 2005
- MRS Spring Meeting 2005