In‐plane solvent diffusion in a photosensitive polyimide
- Da‐Yuan Shih
- Sharon Nunes
- et al.
- 2003
- Journal of Applied Polymer Science
Publications
6 results for R.J. Serino
Factors Affecting the Interconnection Resistance and Yield in Multilayer Polyimide/Copper Structures
- Da-Yuan Shih
- Helen L. Yeh
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Electrical characteristics of lossy interconnections for high-performance computer applications
- A. Deutsch
- G.V. Kopcsay
- et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
The effect of solvent absorption on the electrical and dielectric properties of polyimide films
- D.Y. Shih
- J. Cataldo
- et al.
- 1990
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
A study of the chemical and physical interaction between copper and polyimide
- D.Y. Shih
- J. Paraszczak
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
PHOTOCONDUCITIVITY OF INTRINSIC AND DOPED a-Si:H FROM 0. 1 TO 1. 9 ev.
- T. Inushima
- M.H. Brodsky
- et al.
- 1984
- Optical Effects in Amorphous Semiconductors 1984