Publications

9 results for Rafael Reif

Chemical Vapor Deposition of Epitaxial Silicon from Silane at Low Temperatures: I. Very Low Pressure Deposition
- - James H. Comfort
  - Rafael Reif
- 2019
- JES
Chemical Vapor Deposition of Epitaxial Silicon from Silane at Low Temperatures: II. Plasma Enhanced Deposition
- - James H. Comfort
  - Rafael Reif
- 2019
- JES
Investigation and effects of wafer bow in 3D integration bonding schemes
- - K.N. Chen
  - Y. Zhu
  - et al.
- 2010
- Journal of Electronic Materials
Silicon layer stacking enabled by wafer bonding
- - Chuan Seng Tan
  - Kuan-Neng Chen
  - et al.
- 2006
- MRS Fall Meeting 2006
Bonding parameters of blanket copper wafer bonding
- - K.N. Chen
  - A. Fan
  - et al.
- 2006
- Journal of Electronic Materials
Investigations of strength of copper-bonded wafers with several quantitative and qualitative tests
- - K.N. Chen
  - S.M. Chang
  - et al.
- 2006
- Journal of Electronic Materials
The effect of forming gas anneal on the oxygen content in bonded copper layer
- - C.S. Tan
  - K.N. Chen
  - et al.
- 2005
- Journal of Electronic Materials
Characterization of iodoheptafluoropropane as a dielectric etchant. I. Process performance evaluation
- - Simon Karecki
  - Ritwik Chatterjee
  - et al.
- 2001
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Si/Si1-xGexValence Band Discontinuity Measurements Using a Semiconductor-Insulator-Semiconductor (SIS) Heterostructure
- - Brian R. Bennett
  - Emmanuel F. Crabbé
  - et al.
- 1994
- IEEE Transactions on Electron Devices