Bending of flex leads during thermal cycling
- L.T. Shi
- Ho-Ming Tong
- 1993
- MRS Fall Meeting 1993
Publications
24 results for Ho‐Ming Tong
Thickness‐direction thermal expansion of polyimide films
- Ho-Ming Tong
- K.L. Saenger
- et al.
- 1993
- Polymer Engineering & Science
Effects of Parylene Coating on the Thermal Fatigue Life of Solder Joints in Ceramic Packages
- Ho-Ming Tong
- Lawrence S. Mok
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Dimensional changes of polyimide films during curing
- C. Feger
- Ho-Ming Tong
- et al.
- 1991
- ANTEC Annual Technical Conference 1991
Thickness-direction coefficient of thermal expansion measurement of thin polymer films
- Ho-Ming Tong
- H.K.D. Hsuen
- et al.
- 1991
- Review of Scientific Instruments
Integrity of ceramic packages upon liquid nitrogen cycling
- Ho-Ming Tong
- H.L. Yeh
- et al.
- 1989
- ECTC 1989
A study of solvent diffusion in thin polyimide films using laser interferometry
- Ho-Ming Tong
- K.L. Saenger
- et al.
- 1989
- Journal of Polymer Science, Part B: Polymer Physics
Improved polyimide/polyimide adhesion via swelling agent enhanced interdiffusion
- K.L. Saenger
- Ho-Ming Tong
- et al.
- 1989
- Journal of polymer science. Part C, Polymer letters
Ceramic Packages for Liquid-Nitrogen Operation
- Ho-Ming Tong
- Helen L. Yeh
- et al.
- 1989
- IEEE T-ED
High-temperature thin-film Pt-Ir thermocouple with fast time response
- Ho-Ming Tong
- G. Arjavalingam
- et al.
- 1987
- Review of Scientific Instruments