Reduced Cu interface diffusion by CoWP surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Microelectronic Engineering
Conference paper
Publications
9 results for C.J. Sambucetti
Reduced electromigration of Cu wires by surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- Applied Physics Letters
PaperSelective plating of nickel ceramic composite films for MEMS applications
- K.S. Teh
- Y.T. Cheng
- et al.
- 2002
- Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
PaperFabrication of micropipes for optical interconnects using electroless processes
- Yu-Ting Cheng
- Carlos Sambucetti
- et al.
- 2001
- IMECE 2001
Conference paperFabrication of micropipes for optical interconnects using electroless processes
- Yu-Ting Cheng
- Carlos Sambucetti
- et al.
- 2001
- IMECE 2001
Conference paperPb-free solder alloys for flip chip applications
- S.K. Kang
- J. Horkans
- et al.
- 1999
- ECTC 1999
Conference paperPolymer/metal composite for interconnection technology
- Ravi F. Saraf
- Judith Roldan
- et al.
- 1995
- ECTC 1995
Conference paperINITIATION OF ELECTROLESS Cu PLATING ON NONMETALLIC SURFACES.
- J. Horkans
- C.J. Sambucetti
- et al.
- 1984
- IBM J. Res. Dev
PaperMagnetic ink for jet printing
- C.J. Sambucetti
- 1980
- IEEE Transactions on Magnetics
Paper