Pushing ASIC performance in a power envelope
Ruchir Puri, Leon Stok, et al.
DAC 2003
In this paper we develop an approach to model interconnect delay under process variability for timing analysis and physical design optimization. The technique allows for closed-form computation of interconnect delay probability density functions (PDFs) given variations in relevant process parameters such as linewidth, metal thickness, and dielectric thickness. We express the resistance and capacitance of a line as a linear function of random variables and then use these to compute circuit moments. Finally, these variability-aware moments are used in known closed-form delay metrics to compute interconnect delay PDFs. We compare the approach to SPICE based Monte Carlo simulations and report an error in mean and standard deviation of delay of 1% and 4% on average, respectively.
Ruchir Puri, Leon Stok, et al.
DAC 2003
Suyoung Bang, Jae-Sun Seo, et al.
IEEE JSSC
Kanak Agarwal, Harmander Deogun, et al.
ISQED 2006
Scott Hanson, Bo Zhai, et al.
ISLPED 2006