Uttam Ghoshal, R. Schmidt
Digest of Technical Papers - IEEE International Solid-State Circuits Conference
This letter introduces the concept of a thermoelectromechanical cooler (TEMC), which modifies a traditional thermoelectric cooler (TEC) by using intermittent contact of a mechanical element synchronized with an applied pulsed current. Using Bi2Te3 as the thermoelectric material, it is predicted that the maximum temperature drop across a TEMC operated under zero applied heat flux is about 35% higher than that of a TEC. This effectively increases the thermoelectric figure of merit for maximum temperature differential applications by a factor of 1.8. © 1999 American Institute of Physics.
Uttam Ghoshal, R. Schmidt
Digest of Technical Papers - IEEE International Solid-State Circuits Conference
Sandip Kundu, Uttam Ghoshal
EDTC 1997
Uttam Ghoshal, S. Ghoshal, et al.
Applied Physics Letters
Uttam Ghoshal, Y.S. Ju, et al.
ICTEC 1999