Conference paper
Model to hardware matching: For nano-meter scale technologies
Sani R. Nassif
SISPAD 2006
In this brief, a temperature-and variation-aware electromigration analysis (T-VEMA) tool for power grid wires is described. First, T-VEMA performs a two-stage interconnect thermal analysis on a full chip. Next, the tool extracts the effective jL product values and performs an electromigration (EM) lifetime calculation on ideally manufactured mortal wires on the basis of thermal effects. Finally, T-VEMA analyzes process variation effects on EM reliability at global and local levels and reports variation tolerances of EM-sensitive power grid wires.
Sani R. Nassif
SISPAD 2006
Zhong Guan, Malgorzata Marek-Sadowska, et al.
IITC/AMC 2014
Sani R. Nassif, Gi-Joon Nam, et al.
ISQED 2013
Ulf Schlichtmann, Veit B. Kleeberger, et al.
DATE 2014