Juan-Antonio Carballo, Sani R. Nassif
IEEE Design and Test of Computers
In this brief, a temperature-and variation-aware electromigration analysis (T-VEMA) tool for power grid wires is described. First, T-VEMA performs a two-stage interconnect thermal analysis on a full chip. Next, the tool extracts the effective jL product values and performs an electromigration (EM) lifetime calculation on ideally manufactured mortal wires on the basis of thermal effects. Finally, T-VEMA analyzes process variation effects on EM reliability at global and local levels and reports variation tolerances of EM-sensitive power grid wires.
Juan-Antonio Carballo, Sani R. Nassif
IEEE Design and Test of Computers
Ulf Schlichtmann, Veit B. Kleeberger, et al.
DATE 2014
Sani R. Nassif
ISQED 2000
Binjie Cheng, Xingsheng Wang, et al.
ISCAS 2013