R.M. Feenstra, D.A. Collins, et al.
Physical Review Letters
The surface morphology of silicon (100) wafers has been measured by scanning tunneling microscopy. Samples which were bombarded with low-energy argon ions are found to have an average root-mean-square roughness of 4.0 Å, and the surfaces are covered with characteristic 50-Å-diam hillocks. The roughness of nonbombarded (control) samples is observed to be 1.8 Å, and this roughness arises in part from disorder at the interface between a native oxide and the silicon substrate.
R.M. Feenstra, D.A. Collins, et al.
Physical Review Letters
T.O. Sedgwick, S. Cohen, et al.
ECS Meeting 1983
J.R. Kirtley, R.M. Feenstra, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
X.C. Mu, S.J. Fonash, et al.
Journal of Applied Physics