Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperSuperconductivity of lanthanum intermetallic compounds with the Cu3Au structureR.J. Gambino, N.R. Stemple, et al.Journal of Physics and Chemistry of Solids
PaperDesigning catalysts with deep generative models and computational data. A case study for Suzuki cross coupling reactionsOliver Schilter, Alain Vaucher, et al.Digital Discovery
