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PaperDirected assembly of lamellae-forming block copolymers by using chemically and topographically patterned substratesSang-Min Park, Mark P. Stoykovich, et al.Advanced Materials
Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweepS. Cohen, J.C. Liu, et al.MRS Spring Meeting 1999
PaperHarmonic analysis in rheological property measurementThomas E. Karis, C. Mark Seymour, et al.Rheologica Acta
