New polysilicon disposable sidewall process for sub-50 nm CMOS
K.L. Lee, D. Boyd, et al.
ESSDERC 2001
An innovative and simple method, based on electron-beam (e-beam) overlapping and overexposure techniques, is developed to fabricate sub-10 nm electrode gaps with very good electrical properties. Gaps with 4 to 10 nm spacing can be fabricated using a proper e-beam dose and pattern-developing time. The fabrication yield is nearly 100% for 8-9 nm gaps, but significantly smaller for 3-4 nm gaps. The gap leakage resistance is around 10 12-1013, implying very good isolation. As an example, we present a transport study on a single 8 nm Co particle junction using a 10 nm gap. © 2002 American Institute of Physics.
K.L. Lee, D. Boyd, et al.
ESSDERC 2001
F. Bozso, Ph. Avouris
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
R. Cao, F. Bozso, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Yanning Sun, E.W. Kiewra, et al.
IEDM 2008