PaperSoft x-ray investigation of the effect of growth conditions on InAs/GaAs heterostructuresA. Krol, C.J. Sher, et al.Surface Science
PaperElectrochemical characterization of adsorption-desorption of the cuprous-suppressor-chloride complex during electrodeposition of copperJohn G. Long, Peter C. Searson, et al.JES
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
