Fernando Marianno, Wang Zhou, et al.
INFORMS 2021
Using an advanced reflection high energy electron diffraction (RHEED) system we found oscillations of the in-plane lattice spacing on the monolayer scale during deposition of Co on Cu(001) [J. Fassbender et al., Phys. Rev. Lett. 75 (1995) 4476]. Here we present in detail the influence of the deposition rate on these oscillations and therefore on the growth process. With increasing deposition rate an enhanced variation of the in-plane lattice spacing occurs which is interpreted as a transition from a layer-by-layer to a more three-dimensional growth mode only for the first two monolayers. An unexpected linear behavior between the deposition rate and the maximum in-plane relaxation is found.
Fernando Marianno, Wang Zhou, et al.
INFORMS 2021
Peter J. Price
Surface Science
Surendra B. Anantharaman, Joachim Kohlbrecher, et al.
MRS Fall Meeting 2020
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008