Chemical vapor deposition of copper alloys
C. Smart, S.K. Reynolds, et al.
MRS Proceedings 1992
This paper discusses the circuits, packaging, and antennas needed to realize a low-cost millimeter-wave transceiver with integrated antenna in silicon technology. The principal application envisioned is in high-speed 60-GHz wireless networks, but the concepts may be applicable to other products as well, such as 77-GHz radar sensors. Circuit results are presented for both 60 and 77 GHz, including an LNA, a highly-integrated direct downconverter, a mixer for a superheterodyne receiver, and a power amplifier. Packaging issues which arise at millimeter-wave frequencies are discussed, and a packaging approach involving a Si IC and a planar antenna in the same package is described. Measurement results for a planar Vivaldi antenna are presented as an example. © 2005 IEEE.
C. Smart, S.K. Reynolds, et al.
MRS Proceedings 1992
Hyun J. Shin, S.K. Reynolds, et al.
LPE 1994
Victor Chan, Ken Rim, et al.
CICC 2005
D.J. Frank, P. Solomon, et al.
LPED 1997