PaperSuperconductivity of lanthanum intermetallic compounds with the Cu3Au structureR.J. Gambino, N.R. Stemple, et al.Journal of Physics and Chemistry of Solids
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperOn the Crystal Structure of Azafullerene (C59N)2C.M. Brown, L. Cristofolini, et al.Chemistry of Materials
